Kamampuh Desain
| Lapisan desain Max | 40 lapisan |
| Jumlah pin maksimum | 60.000 |
| Sambungan Max | 40.000 |
| Lebar garis minimum | 3 mil |
| Jarak garis minimum | 3 mil |
| Minimum via | 6 mil (bor laser 3 mil) |
| Jarak pin maksimum | 0.44mm |
| Konsumsi kakuatan Max / PCB | 360W |
| HDI Ngawangun | 1 + n + 1; 2 + N + 2, X + N + X, Sagala lapisan HDI dina R&D |
Kamampuh Pangiriman
| Jumlah pin | Pangiriman (Dinten damel) |
| 0-2,000 | 3-5 |
| 2.000-4.000 | 5-8 |
| 4.000-6,000 | 8-12 |
| 6.000-8,000 | 12-15 |
| 8.000-10.000 | 15-18 |
| 10.000-12.000 | 18-20 |
| 12,000-14,000 | 20-22 |
| 14,000-16,000 | 22-25 |